By Mark LaPedusToday, there is more uncertainty than ever in lithography. Until recently, for example, leading-edge logic chipmakers have been planning to extend 193nm immersion with multiple patterning to the 14nm and 10nm nodes. This is because the leading NGL candidate—extreme ultraviolet (EUV) lithography—remains delayed and isn’t ready for 10nm.But in a recent and surprise move, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) now plans to insert EUV at 10nm, according to Pacific Crest Securities, even though there are still many challenges with the technology. For that reason, Intel, GlobalFoundries and others are maintaining their respective lithography roadmaps and will continue to target EUV for 7nm. In addition, the other NGLs—such as directed self-assembly (DSA), maskless and nano-imprint—are still in the hunt at advanced nodes.Adding more uncertainty to the lithographic roadmap are apparent delays with the migration toward the next-generation 450mm wafer size. Intel, according to Pacific Crest Securities, has pushed out 450mm beta equipment deliveries to about the end of 2015, which is a delay of about three quarters.Uncertainties with NGL and the 450mm wafer transition present a multitude of challenges for chipmakers and fab tool vendors alike. It also adds more confusion in an already cloudy landscape in lithography…. Read full this story
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